MFR #:2892421
EIS #:LOC17723
Series #:LOC-348
MFR #:2892421
EIS #:LOC17723
Series #:LOC-348
Temporarily Out of Stock
Min Qty:1
|Qty Increment:1
Pack:10/Case
more info
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Loctite 348 surface mount adhesive (Chipbonder) is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium- to high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. 348 is a very fast curing, one-component epoxy resin, shear thinning adhesive. One-component requires no mixing and is heat cure. Medium dispense speed of 15000 - 25000 dots/hr. High dot profile reaches components with large standoffs.
$125.00 / each
Pack: 10/Case
Min Qty:1
|Qty Increment:1
Pack:10/Case
more info
more info
more info
Loctite 348 surface mount adhesive (Chipbonder) is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium- to high-dispense speeds, high-dot profile, high-wet strength and good electrical characteristics are required. 348 is a very fast curing, one-component epoxy resin, shear thinning adhesive. One-component requires no mixing and is heat cure. Medium dispense speed of 15000 - 25000 dots/hr. High dot profile reaches components with large standoffs.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameSurface Mount Adhesive
Trade NameChipbonder®
SeriesLOC-348
General Features
Shelf Life9 Months
Storage Temperature2 to 8 °C
TypeHigh Viscosity
Design & Construction
ColorOrange
Cure TypeHeat Cure
FormPaste
Performance Details
Shear Strength1450 psi at 150 °C
Full Cure Time90 sec at 150 °C
Chemical Properties
CompositionEpoxy
Specific Gravity1.2
Electrical Properties
Dielectric StrengthSee TDS
Physical Properties
Container Size10mL
Container TypeSyringe
Supporting Information
Application MethodMedium Speed Syringe Dispensing
Features
- One component - requires no mixing
- Positive under UV light
- High wet strength
Applications
- For Small Parts Bonding