Thermal Management Solutions
Converting reliable high-performance thermal phase change, heat sink, and conductive silicone gap filler materials.
EIS specializes in precision-engineered converting of thermal and power management materials to provide premium heat management for today’s power and electronic devices.
These materials transfer heat from electronic components to thermal heat sinks, providing our customers with cost-effective thermal management systems to extend the life of your electronic components.
Applications include power electronics, medical devices, motor control components, and any high heat electronic devices where heat transfer or resistance is required.
EIS also serves various markets with thermally conductive adhesive solutions and electrically conductive interface materials.
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CUSTOM SOLUTIONS AND RETROFITS
EIS collaborates with device engineers early in the design stage to determine the appropriate materials and processes necessary to fully manage the thermal challenge. Our premium thermal interface materials and engineered solutions ensure high thermal conductivity, with low thermal impedance. This not only enhances performance but also extends the product lifetime for numerous applications.
Our Fabrications Solutions team can provide product design, process development and rapid prototyping to any custom design.
MATERIALS
Whether you need materials for heat dissipation, insulation, dampening, thermal transfer, or flame resistance, EIS has you covered.
We stock numerous thermal management materials from top suppliers like Henkel Adhesives (Berquist), Parker Hannifin (Chomerics), 3M and St Gobain.
CONDUCTIVE ADHESIVES AND GREASES →
These include phase change materials, adhesives and greases that sit between heat generators and heat sinks, pressure-sensitive tapes that mount to heat sinks, thermal fabrics providing thermal conductivity, silicone sponge materials for heat absorption, and more. Conductive adhesives and greases are sourced from top suppliers such as 3M, DuPont, Von Roll, and Saint-Gobain.
These materials ensure efficient thermal management, enhancing the performance and longevity of various components by maintaining optimal operating temperatures and preventing overheating.
Adhesive tapes are available for various applications, including bonding, joining, marking, and covering for use in industries and fields such as electrical, automotive, manufacturing, and much more. These tapes eliminate the need for mechanical fasteners, saving both material and process costs. Many tapes are offered, including electrical tape, vibration dampening tape, die-cut foam tape, transfer tape, and more.
EIS specializes in converting coated fabrics for thermal management and insulation applications. We laminate, slit, and die-cut numerous materials to provide high-temperature resistance and excellent dielectric strength. Our coated fabrics are designed for precise, clean edge cuts to prevent unraveling. Fabrics can be laminated with pressure-sensitive or conductive adhesives, ideal for robust thermal management. These customized solutions ensure optimal performance and durability in demanding thermal environments.
PHASE-CHANGE MATERIALS
Phase change materials (PCM) melt and solidify at specific temperatures, storing and releasing large amounts of energy. EIS supplies PCMs such as 3M 8926-02 and Nitto-Denko TR-5925, ideal for maintaining stable temperatures in various applications. These materials are essential for applications requiring precise temperature control, as they help regulate heat flow and prevent overheating. PCMs are used in industries ranging from electronics to automotive, ensuring devices operate within safe temperature ranges and enhancing overall performance and reliability.
CERAMIC & METAL-FILLED ELASTOMER GAP-FILLERS
Gap fillers conform to intricate surfaces, eliminating thermal stress within the component, and ensure high reliability. They create efficient heat transfer pathways between heat-generating mechanisms, heat sinks, heat spreaders, and other cooling devices, maintaining component performance and longevity. EIS can custom-convert gap fillers for specific applications, such as Interface Pad 3M 5595, which offers excellent thermal conductivity. Their adaptable nature allows them to fill intricate air voids, suitable for various gaps, components, and high-volume manufacturing operations. These materials optimize thermal resistance and enhance device reliability.
Let us help you find thermal management solutions!