MFR #:7100148760
EIS #:3MADP100FR
UPC #:00048011567426
MFR #:7100148760
EIS #:3MADP100FR
UPC #:00048011567426
In Stock
Min Qty:1
|Qty Increment:1
Pack:12/Case
more info
3M Scotch-Weld epoxy adhesive DP100FR is a flame retardant, non-sag, two-part, rigid epoxy adhesive offering a fast cure and machinability. It is a fast-setting epoxy that cures at room temperature to form a rigid bond. - Low viscosity for easy dispensing and leveling. Non-sag formulation ensures adhesive stays where applied.
$43.18 / each
Pack: 12/Case
Min Qty:1
|Qty Increment:1
Pack:12/Case
more info
3M Scotch-Weld epoxy adhesive DP100FR is a flame retardant, non-sag, two-part, rigid epoxy adhesive offering a fast cure and machinability. It is a fast-setting epoxy that cures at room temperature to form a rigid bond. - Low viscosity for easy dispensing and leveling. Non-sag formulation ensures adhesive stays where applied.
- Attributes
- Features
- Applications
- Documents
Attributes
General Information
Item NameEpoxy Adhesive
Trade NameScotch-Weld™
General Features
Shelf Life15 Months
StandardsOSHA Approved, 29 CFR 1910.1200 Certified
Storage Temperature72 °F
Design & Construction
Cure TypeRoom Temperature
Color - Part-AWhite
Color - Part-BWhite
Form - Part-ALiquid
Form - Part-BLiquid
Chemical Properties
Composition - Part-AMercaptan
Composition - Part-BEpoxy Resin
Specific Gravity - Part-A1.3
Specific Gravity - Part-B1.2
Viscosity - Part-A35000 - 85000 cP
Viscosity - Part-B60000 - 80000 cP
Physical Properties
Container Size50mL
Container TypeDual Cartridge
Hardness87 Shore D
Odor/Scent - Part-AStrong Mercaptan
Odor/Scent - Part-BEpoxy
Features
- Adhesive formula cures rigid for high static load holding
- High shear ensures permanent bonds
- Fast 6 min work life with handling strength in about 15 min at room temperature
- Non-sag formulation ensures adhesive stays where applied
Applications
- For Bonding, Gluing, Joining, Attaching, Assembling, Encapsulating, Potting and Sealing, General Industrial, Sporting Goods, Solar Energy, Wind Energy, Electronics, Military, Transportation and Aerospace