MFR #:8310000951
EIS #:951-FLUXPEN
Series #:951FP
MFR #:8310000951
EIS #:951-FLUXPEN
Series #:951FP
In Stock
Min Qty:1
|Qty Increment:1
The Kester 951 flux pen is a zero halogen, non-rosin flux pen that is specifically designed for rework of conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. There are no residues to interfere with electrical testing. 951 exhibits improved soldering performance to minimize solder bridges (shorts) during rework operations. - This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical water soluble fluxes. 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
$13.64 / each
Min Qty:1
|Qty Increment:1
The Kester 951 flux pen is a zero halogen, non-rosin flux pen that is specifically designed for rework of conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. There are no residues to interfere with electrical testing. 951 exhibits improved soldering performance to minimize solder bridges (shorts) during rework operations. - This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. The surface insulation resistance on soldered boards is higher than that provided by typical water soluble fluxes. 951 contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
- Attributes
- Features
- Applications
Attributes
General Information
Item NameFlux Pen
Series951FP
General Features
Shelf Life12 Months
Storage Temperature10 to 25 °C
Design & Construction
Flux TypeNo-Clean
FormLiquid
Performance Details
Vapor Density0.81 g/cc
Vapor Pressure59 hPa
Chemical Properties
Chemical CompositionEthanol, Isopropanol
Flux Formula951
Physical Properties
Container Size0.33 Oz
Odor/ScentAlcohol
Supporting Information
Flux DesignatorORL0
Flux Thinner110
RoHS Info2011/65/EU Directive
Features
- Improves soldering performance
- Eliminates the need and expense of cleaning
- Non-corrosive tack-free residues
- Contains halogen
- Vapor density of 0.81 g/cc at 20 °C
- Vapor pressure of 59 hPa at 20 °C
Applications
- For Rework of Conventional and Surface Mount Circuit Board Assemblies