MFR #:R520A-SAC305-89.5
EIS #:PH19-R520A-SAC305-89.5
Series #:R520A-SAC305-89.5
MFR #:R520A-SAC305-89.5
EIS #:PH19-R520A-SAC305-89.5
Series #:R520A-SAC305-89.5
The Kester R520A is a lead-free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A is an extremely stable water soluble formula. - R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.
$134.29
- $206.02
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The Kester R520A is a lead-free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A is an extremely stable water soluble formula. - R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.
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Container Size: 600 g | Container Type: Cartridge | EIS Part #: SN965AG3R520A-600G | $ / Piece |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameLead-Free Solder Paste
SeriesR520A-SAC305-89.5
General Features
Shelf Life4 Months
Storage Temperature0 to 10 °C
TypeLead-Free
Design & Construction
ColorSilver Gray
FormPaste
Flux TypeOrganic Activated or Water Soluble
Particle TypeType 3
Chemical Properties
Flux FormulaR520A
Lead FreeYes
Mesh Size-325/+500
Physical Properties
AlloySn96.5 Ag3.0 Cu0.5 (SAC305)
Environmental Condition
Melting Range220 °C
Supporting Information
Applicable MaterialsStainless Steel, Molybdenum, Nickel Plated or Brass
Flux DesignatorORH0
RoHS Info2011/65/EU Directive
Features
- Stable tack life to long stencil life
- Consistent printing over a range of temperatures and humidities
- Excellent wetting onto Ag/Pd leaded components
- Lead-free and water soluble
- Print speed up to 150 mm/sec (6 Inch/sec)
- Reduces scrap due to less paste dry out
- Residues easily removed with hot DI water
- Metals percentage of 89.5%
- Melting range of SAC305 alloy (Sn96.5Ag3.0Cu0.5) is 217-220 °C (422-428 °F)
Applications
- For Stencil Printing Applications