MFR #:C&H-SBRW/IHSC
EIS #:PH23-C&H-SBRW/IHSC
Series #:C&H-SBRW/IHSC
MFR #:C&H-SBRW/IHSC
EIS #:PH23-C&H-SBRW/IHSC
Series #:C&H-SBRW/IHSC
Vishay® Silicon Bridge Rectifier With Integral Heat Sink Case terminals round silver plated copper pins or fast-on terminals. Built-in stress relief mechanism for superior reliability and performance. Integrally molded heat sink provides very low thermal resistance for maximum heat dissipation. - C and H Technology Silicon Bridge Rectifier With Integral Heat Sink Case, 35A, 1.12 - 1.13 Inch W x 0.38 - 0.4 Inch D x 1.12 - 1.13 Inch H, Molded Epoxy, -55 to 150 °C, Fast-On Terminal.
$7.54
- $8.00
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Vishay® Silicon Bridge Rectifier With Integral Heat Sink Case terminals round silver plated copper pins or fast-on terminals. Built-in stress relief mechanism for superior reliability and performance. Integrally molded heat sink provides very low thermal resistance for maximum heat dissipation. - C and H Technology Silicon Bridge Rectifier With Integral Heat Sink Case, 35A, 1.12 - 1.13 Inch W x 0.38 - 0.4 Inch D x 1.12 - 1.13 Inch H, Molded Epoxy, -55 to 150 °C, Fast-On Terminal.
Product Options
Showing 3 out of 3 options
Input Voltage: 1000 V | EIS Part #: DB3510PT | $ / Piece | ||
Input Voltage: 600 V | EIS Part #: DB3506PT | $ / Piece | ||
Input Voltage: 400 V | EIS Part #: DB3504PT | $ / Piece |
- Attributes
- Features
Attributes
General Information
Item NameSilicon Bridge Rectifier with Integral Heat Sink Case
SeriesC&H-SBRW/IHSC
General Features
StandardsUL File No E141956 Listed, RoHS Compliant
Design & Construction
MaterialMolded Epoxy
Terminal TypeFast-On
Electrical Properties
Amperage Rating35 A
Physical Properties
Dimensions1.12 - 1.13 Inch W x 0.38 - 0.4 Inch D x 1.12 - 1.13 Inch H
Features
- Soldering per MIL-STD 202 method 208 guaranteed
- Terminals round silver plated copper pins or fast-on terminals
- Polarity marked on side of case
- Round silver plated copper pins or fast-on terminals
- Epoxy carries a UL flammability rating of 94V-0
- 20 Inch-lb Maximum mounting torque
- Void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area)
- Built-in stress relief mechanism for superior reliability and performance
- Integrally molded heat sink provides very low thermal resistance for maximum heat dissipation
- Any through hole for #8 Screw
- 500A (IFSM) peak forward surge current, 35A average forward rectified, 1-50mA (IRM) maximum reverse current
- 1.2 °C/W RJC typical thermal resistance
- Temperature Rating: -55 to 150 °C