MFR #:170
EIS #:PH11-170
Series #:170
MFR #:170
EIS #:PH11-170
Series #:170
Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. - Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule.
$676.58
- $1,918.60
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Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. - Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule.
Product Options
Showing 4 out of 4 options
Container Size: 4.9kg | Color: Off White | EIS Part #: DC170X4.9KG-B | $ / Pail | ||
Container Size: 4.9kg | Color: Black | EIS Part #: DC170X4.9KG-A | $ / Pail | ||
Container Size: 22.6kg | Color: Off White | EIS Part #: DC170X22.6KG-B | $ / Pail | ||
Container Size: 22.6kg | Color: Black | EIS Part #: DC170X22.6KG-A | $ / Pail |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSilicone Elastomer
Trade NameSylgard®
Series170
General Features
StandardsWEEE/RoHS Compliant
Design & Construction
Cure TypeRoom Temperature/Heat Cure
FormLiquid
Chemical Properties
CompositionSilicone
Specific Gravity1.37
Physical Properties
Container TypePail
Odor/ScentSlight
Hardness47 Shore A
Features
- Low viscosity
- Rapid room temperature or heat accelerated cure
- Moderate thermal conductivity
- Rapid, versatile cure processing controlled by temperature
- Shorter room temperature cure reduces cycle time
- Low viscosity enhances flow and fill in narrow spaces and around complex geometries
- Can be considered for uses requiring added flame resistance
- Thermosetting thermal resistance
- High and low temperature stable
Applications
- For use as a General Potting Material for Power Supplies, Connectors, Sensors, Industrial Controls, Transformers, Amplifiers, High Voltage Resistor Packs, Relays