MFR #:170K
EIS #:PH11-170K
Series #:170K
MFR #:170K
EIS #:PH11-170K
Series #:170K
Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. This material has a UL 94 - V-0 flame rating. - 2-part, 1:1 mix, black, general purpose encapsulant with good flowability, long working time and flame resistance. Sylgard 170 silicone elastomer is suitable for use as an encapsulant or potting material.
$107.65
- $133.47
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Dow Corning brand silicone encapsulants are supplied as two-part liquid component kits with a mix ratio of 1:1. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. This material has a UL 94 - V-0 flame rating. - 2-part, 1:1 mix, black, general purpose encapsulant with good flowability, long working time and flame resistance. Sylgard 170 silicone elastomer is suitable for use as an encapsulant or potting material.
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Container Size: 0.9kg | EIS Part #: DC170X0.9KG | $ / Kit |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSilicone Elastomer
Trade NameSylgard®
Series170K
General Features
StandardsWEEE/RoHS Compliant
TypePart A and B
Design & Construction
Cure TypeRoom Temperature/Heat Cure
Color - Part-ABlack
Color - Part-BOff White
Form - Part-ALiquid
Form - Part-BLiquid
Chemical Properties
Composition - Part-ASilicone
Composition - Part-BSilicone
Specific Gravity - Part-A1.37
Specific Gravity - Part-B1.37
Viscosity - Part-A3000 sq-mm/sec
Viscosity - Part-B2000 sq-mm/sec
Physical Properties
Container TypeKit
Hardness47 Shore A
Odor/Scent - Part-ASlight
Odor/Scent - Part-BSlight
Features
- Low viscosity
- Rapid room temperature or heat accelerated cure
- Moderate thermal conductivity
- Rapid, versatile cure processing controlled by temperature
- Shorter room temperature cure reduces cycle time
- Low viscosity enhances flow and fill in narrow spaces and around complex geometries
- Can be considered for uses requiring added flame resistance
- Thermosetting thermal resistance
- High and low temperature stable
Applications
- For use as a General Potting Material for Power Supplies, Connectors, Sensors, Industrial Controls, Transformers, Amplifiers, High Voltage Resistor Packs, Relays