MFR #:R276-6337-87
EIS #:PH19-R276-6337-87
Series #:R276-6337-87
MFR #:R276-6337-87
EIS #:PH19-R276-6337-87
Series #:R276-6337-87
The Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. - R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.
$23.34
- $68.14
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The Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. - R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.
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Container Size: 35 g | EIS Part #: SN63R276-35G | $ / each |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameSolder Paste
SeriesR276-6337-87
General Features
Shelf Life6 Months
Storage Temperature0 to 10 °C
Design & Construction
ColorSilver Gray
FormPaste
Flux TypeNo-Clean
Particle TypeType 3
Chemical Properties
Flux FormulaR276
Mesh Size-325/+500
Physical Properties
Container TypeSyringe
Odor/ScentMild
AlloySn63 Pb37
Environmental Condition
Melting Range183 °C
Supporting Information
Flux DesignatorROL0
RoHS Info2011/65/EU Directive
Features
- Available with lead-free alloys
- Capable of several thousands of dots per hr in high speed automated dispense equipment
- Contains halogen
- Compatible with Kester easy profile 256 stenciling solder paste
- Excellent dispensing characteristics using 22 ga needles and type 3 powder
- High activity on all substrates, including OSPs
- Manufactured and packaged void-free to insure the most consistent dispensability available
- Stable tack over 8+ hr
- Metals percentage of 87%
- Temperature rating of 21 to 25 °C
Applications
- For Stencil Printing Applications