Kester 958 No-Clean Soldering Flux
MFR #:958
EIS #:PH19-958
Series #:958
MFR #:958
EIS #:PH19-958
Series #:958
The Kester 958 is a no-clean, non-corrosive liquid flux that is specifically designed for the wave soldering of conventional and surface mount circuit board assemblies. 958 was developed to give excellent soldering performance on bare copper printed circuit boards treated with OSP coatings. Essentially, no residue remains after soldering. A major advantage of this flux is the reduced odor associated with the soldering process. - Boards are dry and cosmetically clean as they exit the wave solder machine, thus posing no interference with electrical testing. 958 has excellent compatibility with most conformal coating products on the market today. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue.
$97.02
- $121.09
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The Kester 958 is a no-clean, non-corrosive liquid flux that is specifically designed for the wave soldering of conventional and surface mount circuit board assemblies. 958 was developed to give excellent soldering performance on bare copper printed circuit boards treated with OSP coatings. Essentially, no residue remains after soldering. A major advantage of this flux is the reduced odor associated with the soldering process. - Boards are dry and cosmetically clean as they exit the wave solder machine, thus posing no interference with electrical testing. 958 has excellent compatibility with most conformal coating products on the market today. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue.
Product Options
Showing 3 out of 3 options
Container Size: 1 gal | EIS Part #: KES958G | $ / US gallon | ||
Container Size: 5 gal | EIS Part #: KES9585G | $ / US gallon | ||
Container Size: 53 gal | EIS Part #: KES95853G | $ / US gallon |
- Attributes
- Features
Attributes
General Information
Item NameSoldering Flux
Series958
General Features
Shelf Life36 Months
Storage Temperature10 to 25 °C
Design & Construction
ColorClear
FormLiquid
Flux TypeNo-Clean
Performance Details
Vapor Pressure43 hPa
Chemical Properties
Chemical CompositionIsopropanol, Bis(2-Butoxyethyl) Ether, Proprietary Carboxylic Acid, Aliphatic Ketone, Water
Flux Formula958
Specific Gravity0.806
Physical Properties
Odor/ScentMild
Supporting Information
Flux DesignatorORL0
RoHS Info2015/863 Directive
Features
- Excellent for bare copper circuit board technology
- Compatible with conformal coat processes
- Improves soldering performance
- Reduced odor associated with soldering process
- Eliminates the need and expense of cleaning
- Non-corrosive tack-free residues
- Temperature rating of 90 to 105 °C
- Vapor pressure of 43 hPa at 20 °C