MFR #:1125
EIS #:PH22-1125
MFR #:1125
EIS #:PH22-1125
3M copper foil tape 1125 is typically used in a variety of EMI/RFI shielding applications such as shielding small electromagnetic components, repair and modification of printed wiring boards, flat conductor assemblies, prototype designs, supplementary shielding of joints and seams and shielding cable splices. - 3M 1125 tape consists of a 1 oz rolled copper foil with an acrylic, pressure sensitive adhesive. Acrylic adhesive with excellent bond strength. Supplied on a removable liner for easy handling and die-cutting. Has a backing thickness of 1.4 Mil.
$64.93
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3M copper foil tape 1125 is typically used in a variety of EMI/RFI shielding applications such as shielding small electromagnetic components, repair and modification of printed wiring boards, flat conductor assemblies, prototype designs, supplementary shielding of joints and seams and shielding cable splices. - 3M 1125 tape consists of a 1 oz rolled copper foil with an acrylic, pressure sensitive adhesive. Acrylic adhesive with excellent bond strength. Supplied on a removable liner for easy handling and die-cutting. Has a backing thickness of 1.4 Mil.
Product Options
Showing 2 out of 2 options
Width: 1 Inch | EIS Part #: 3M1125X1 | $ / Roll | ||
Width: 0.75 Inch | EIS Part #: 3M1125X.75 | $ / Roll |
- Attributes
- Applications
- Documents
Attributes
General Information
Item NameTape
Trade Name3M
Series1125
General Features
TypeSmooth
Design & Construction
Backing MaterialCopper Foil
ColorCopper
Adhesive TypeAcrylic
Performance Details
Flame RetardantYes
Breaking Strength25 lb/Inch
Physical Properties
Length36 Yard
Thickness3.5 mil
Width-
Core Size3 Inch
Elongation5%
Applications
- For EMI/RFI Shielding Applications such as Shielding Small Electromagnetic Components, Repair and Modification of Printed Wiring Boards, Flat Conductor Assemblies, Prototype Designs, Supplementary Shielding of Joints and Seams and Shielding Cable Splices