MFR #:C665
EIS #:PH22-C665
MFR #:C665
EIS #:PH22-C665
Saint-Gobain copper C665 tape is designed for conductivity through the entire construction. The copper foil and acrylic adhesive are both electrically conductive and the release liner aids in die-cutting. - The EMI/RFI shielding seals components from radiating or leaking interference. Both tapes offer solvent resistance. Backing thickness of 0.0014 Inch.
$38.68
- $177.67
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Saint-Gobain copper C665 tape is designed for conductivity through the entire construction. The copper foil and acrylic adhesive are both electrically conductive and the release liner aids in die-cutting. - The EMI/RFI shielding seals components from radiating or leaking interference. Both tapes offer solvent resistance. Backing thickness of 0.0014 Inch.
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Width: 0.5 Inch | EIS Part #: FURONC665X.5 | $ / Roll |
- Attributes
- Features
- Applications
Attributes
General Information
Item NameTape
Trade NameFuron
SeriesC665
General Features
TypeSmooth
Design & Construction
Adhesive TypeAcrylic
Backing MaterialCopper Foil
ColorCopper
Performance Details
Adhesive Strength35 oz/Inch
Flame RetardantYes
Tensile Strength70 lb/Inch
Physical Properties
Core Size3 Inch
Length36 Yard
Thickness3.5 mil
Environmental Condition
Temperature Rating250 °F
Features
- Temperature rating of -40 to 250 °F
Applications
- For IC Chips, Electrical Cabinets, Cables Motors and Static Dissipation