Loctite 3874 Thermally Conductive Adhesive, 25mL Syringe, Gray
MFR #:234972
EIS #:LOC30579
Series #:3874
MFR #:234972
EIS #:LOC30579
Series #:3874
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Loctite 3874 is a thermally conductive adhesive. When used with activator 7387 it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. The thixotropic nature of Loctite 3874 reduces the migration of liquid product after application to the substrate. LOCTITE® 3874 is a light gray, opaque, thixotropic, thermally conductive acrylic ester adhesive. When used with Activator 7387, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. Typical applications include bonding heat sinks to heat dissipating components such as BGAs in electronics applications.
$79.18 / Piece
Min Qty:1
|Qty Increment:1
more info
Loctite 3874 is a thermally conductive adhesive. When used with activator 7387 it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. The thixotropic nature of Loctite 3874 reduces the migration of liquid product after application to the substrate. LOCTITE® 3874 is a light gray, opaque, thixotropic, thermally conductive acrylic ester adhesive. When used with Activator 7387, it cures rapidly to form a high strength, high modulus, thermoset acrylic polymer. Typical applications include bonding heat sinks to heat dissipating components such as BGAs in electronics applications.
- Attributes
- Applications
Attributes
General Information
Item NameThermally Conductive Adhesive
Trade NameHenkel
SeriesLOC-3874
General Features
Shelf Life10 Months
Storage Temperature2 to 8 °C
Design & Construction
ColorGray
Cure TypeActivator, Heat Cure
FormPaste
Performance Details
Tensile Strength>/=1695 psi (Steel), >/=1015 psi (Aluminum)
Full Cure Time24 hr
Chemical Properties
CompositionSilicone
Specific Gravity2.07
Viscosity800000 - 1800000 cP
VOC364g/L
Electrical Properties
Dielectric Strength23.6kV/mm
Physical Properties
Container Size25mL
Container TypeSyringe
Hardness72 Shore D
Odor/ScentMild
Elongation3.2%
Applications
- For Bonding Transformers, Transistors and Other Heat Generating Electronic Components to Printed Circuit Board Assemblies or Heat Sinks